VBCC™ (Vacuum Based Contact Cooling) technology offers the advantages of phase-change cooling without the pitfalls of pressurized gas. This is achieved through forced evaporation rather than forced condensation, and by applying vacuum to a liquid coolant (<0.7 atm abs.) in contact with the heat source. The resulting gas coolant flows to a 1 atm condenser and emits the absorbed heat to the surroundings as it liquidizes. The loop is completed by forcing the liquid coolant to flow back to the heat source.
With an exceptional solid-to-evaporating coolant liquid heat transfer rate, Zuta-Core absorbs an order of magnitude more heat compared to air-cooled heat sinks.
With VBCC™ each heatsink receives the right amount of coolant to dissipate CPU heat at the right time. This is due to the fundamental physics behind VBCC™ technology, and is achieved through a proprietary passive mechanism.
Due to the small size, and no need for airflow, the number of servers installed per rack can be increased by over 50%. When greater computing power per CPU is accounted for, total rack computing power can increase by over 200%.
Zuta-Core employs much thinner piping than water and air-cooling. This enables easy installation. Due to coolant safety, installing the system in a working rack or hot swapping a blade is simple, safe and straightforward.
VBCC™ cools heatsink-chip interfaces to any desired temperature (including well below ambient). VBCC™ technology is ambient-temperature independent, and requires only power without additional infrastructure. Cooling up to 600W, Zuta-Core technology can be installed in a 1U fan drawer chassis. VBCC™ uses smaller radiators than water cooling due to significantly improved radiator efficiency. Zuta-Core's thermal management systems support cooling for individual chips through to full data-center solutions.